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Suntek Electronics Co., Ltd.
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Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Suntek Electronics Co., Ltd.
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Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Brand Name : Suntek Electronics Co., Ltd

Model Number : 2024-PCBA-128

Certification : ISO9001 ISO13485 IATF16949 UL

Place of Origin : China or Cambodia

MOQ : 1pcs

Price : Customized products

Payment Terms : TT,Paypal

Delivery Time : 5-7days after all components kitted

Packaging Details : By ESD bags and carton

Layer : 4 Layers

Impedance control : Yes

Surface Finish : Lead Free HASL

Copper : 1OZ

Warranty : 1 year

X-RAY inspection : For BGA,OFN,QFP with bottom pads

Material : FR4

LW/LS min. : 0.05mm

Thickness : 0.4mm-3mm

silkscreen color : white,black

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Communication PCB Assembly Rigid PCB 2-40 Layers and Rigid-Flex PCB 1-10 Layers for Advanced Downstream Application Field

Suntek Contract Factory:

Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC

assembly,Cable assembly,Mix technology assembly and Box-buildings.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.

Capabilities overview:

Product Name PCB Assembly
PCBA Test AOI, X-RAY, ICT, Function Test
PCB Assembly Method BGA
Minimum Hole Tolerance ±0.05mm
Layers 2-10
PCB Thickness 0.2-7.0mm
Surface Finish HASL, ENIG, OSP, Immersion Silver, Immersion Tin
PCB Process Immersion Gold
PCB Quality System ROHS
Min. Line Width/Spacing 0.1mm
Surface Finish ENIG

Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.

Here are the most common applications of the telecommunication industry that make efficient use of PCBs:

  • Wireless communication systems
  • Mobile phone tower systems
  • Telephonic switching systems
  • PBX systems
  • Industrial wireless communication technology
  • Technology for commercial phones
  • Video conferencing technologies
  • Communication technology used in space
  • Cell transmission and tower electronics
  • High speed servers and routers
  • Electronic data storage devices
  • Mobile communication systems
  • Satellite systems and communication devices
  • Video collaboration systems
  • Land wired communication systems
  • Technology for commercial phones
  • Digital and analog broadcasting systems
  • Voice over Internet Protocol (VoIP)
  • Signal boost systems (online)
  • Security technology and information communication systems

Why is FR-4 still commonly used if industrial PCBs face extreme temperatures?

While special substrates like polyimides and ceramics handle wider temperature swings, FR-4 laminates have evolved “high Tg” versions usable to 150°C+ along with lower cost and better fabricator familiarity. So FR-4 remains an option for many industrial applications not hitting extreme temps.

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field

Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application FieldCommunication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field


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2-40 Layers Communication PCB Assembly

      

Rigid PCB Communication PCB Assembly

      
 Communication PCB Assembly Rigid PCB 2-40 Layers And Rigid-Flex PCB 1-10 Layers For Advanced Downstream Application Field Manufactures

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